MECHANICALLY ANCHORED BACKSIDE C4 PAD

The present invention relates generally to flip chip technology and more particularly, to a method and structure for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure. In an embodiment, a method is disclosed that may include forming a bondi...

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Bibliographic Details
Main Authors FILIPPI RONALD G, ZHANG LIJUAN, KIM ANDREW T, KALTALIOGLU ERDEM, WANG PINGUAN
Format Patent
LanguageEnglish
Published 10.09.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present invention relates generally to flip chip technology and more particularly, to a method and structure for fabricating a mechanically anchored controlled collapse chip connection (C4) pad on a semiconductor structure. In an embodiment, a method is disclosed that may include forming a bonding pad having one or more anchor regions that extend into a semiconductor structure and may inhibit the bonding pad from physically separating from the TSV during temperature fluctuations.
Bibliography:Application Number: US201414198711