THICKNESS SHEAR MODE RESONATOR SENSORS AND METHODS OF FORMING A PLURALITY OF RESONATOR SENSORS
Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may includ...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
03.09.2015
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Subjects | |
Online Access | Get full text |
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Summary: | Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods. |
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Bibliography: | Application Number: US201514707251 |