PROCESS CHAMBER AND SUBSTRATE PROCESSING DEVICE

• Main Authors: LEE JANG HYEOK, LEE JONG HWA, YOON SONG KEUN, KO HYEOG JOON
• Format: Patent
• Language: English
• Published: 16.07.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

The present invention relates to a process chamber and to a substrate processing device. The process chamber according to one embodiment of the present invention includes: a boat in which a plurality of substrates are vertically stacked apart from each; a chamber housing which raises the boat in order to position the boat in an inner space and horizontally injects a process gas from the sidewall and causes the process gas to flow between the substrates which are stacked apart from each other so as to discharge the process gas; a boat elevation unit which elevates the boat into the chamber housing; and a substrate transfer gate at which one side wall of the chamber housing is penetrated. Also, the substrate processing device according to one embodiment of the present invention includes: a process chamber having a boat which causes a plurality of substrates to be stacked apart from each other and injects process gas in between the substrates which are stacked apart from each other in the boat during rotation so as to discharge the process gas; a load lock chamber which is changed from a vacuum state to an atmospheric state or from an atmospheric state to a vacuum state; and a transfer chamber which transfers the substrate transferred in the load lock chamber to the process chamber and transfers the substrate transferred from the process chamber to the load lock chamber.