SEMICONDUCTOR DEVICE

A semiconductor device includes: a package including a base plate and a side wall located on a perimeter of the base plate; a semiconductor element on the base plate; and a lid joined to a top of the side wall and covering the semiconductor element, wherein a first curved surface is located inside t...

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Bibliographic Details
Main Authors OGATA KEIZO, HATA TADAYOSHI
Format Patent
LanguageEnglish
Published 09.07.2015
Subjects
ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR
BASIC ELECTRIC ELEMENTS
CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS
CONVEYING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING THIN OR FILAMENTARY MATERIAL
PACKAGES
PACKAGING ELEMENTS
PACKING
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
STORING
TRANSPORTING
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Summary:A semiconductor device includes: a package including a base plate and a side wall located on a perimeter of the base plate; a semiconductor element on the base plate; and a lid joined to a top of the side wall and covering the semiconductor element, wherein a first curved surface is located inside the package at the top of the side wall, a second curved surface is located on a perimeter of an undersurface of the lid, and the first curved surface of the side wall contacts the second curved surface of the lid.
Bibliography:Application Number: US201414535919