CHIP STACK STRUCTURE USING CONDUCTIVE FILM BRIDGE ADHESIVE TECHNOLOGY

A chip stack structure using conductive film bridge adhesive technology comprises a substrate, a first chip, at least one bridge element, a conductive film, and a second chip. The first chip is electrically connected to a first electrode of the substrate. The at least one bridge element has a first...

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Bibliographic Details
Main Authors LIN TZUIH, LIAO CHIEN-KO
Format Patent
LanguageEnglish
Published 02.07.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A chip stack structure using conductive film bridge adhesive technology comprises a substrate, a first chip, at least one bridge element, a conductive film, and a second chip. The first chip is electrically connected to a first electrode of the substrate. The at least one bridge element has a first bridge surface and a second bridge surface at two ends, and the first bridge surface and the second bridge surface are electrically connected to the first chip and a second electrode of the substrate, respectively. The conductive film is electrically connected to the first bridge surface of the at least one bridge element. The second chip is stacked and electrically connected to the conductive film. Thus, the structure of the present invention not only facilitates the ease of stacking the chips but also increases the effectiveness of the chips heat dissipation and ability of withstanding electrical current.
Bibliography:Application Number: US201414256776