EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS

In a packaged semiconductor device, a die is mounted on a substrate having power connection pads. An exterior (e.g., top) surface of the die has power bond pads and distributed power feed pads. Bond wires electrically connect the power connection pads of the substrate to the power bond pads of the d...

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Bibliographic Details
Main Authors MUNIANDY KESVAKUMAR V.C, TAN LAN CHU, KALANDAR NAVAS KHAN ORATTI
Format Patent
LanguageEnglish
Published 02.07.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In a packaged semiconductor device, a die is mounted on a substrate having power connection pads. An exterior (e.g., top) surface of the die has power bond pads and distributed power feed pads. Bond wires electrically connect the power connection pads of the substrate to the power bond pads of the die, and exterior conductive structures electrically connect the power bond pads of the die to the distributed power feed pads of the die. The exterior conductive structures are printed or pasted onto the exterior die surface. Using exterior conductive structures instead of interior conductive traces (in the die) reduces resistive power losses and frees up more room for routing signals within the interior die layers.
Bibliography:Application Number: US201314141465