SCTP BUNDLING

A method for transmitting upper layer application messages into a SCTP packet in which messages are bundled into a packet comprising a SCTP header and a payload. The method comprises receiving messages from an upper layer application; processing messages through a first process stage in which messag...

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Bibliographic Details
Main Authors NORLANDER MAGNUS, CAMPBELL LOUDON LEE
Format Patent
LanguageEnglish
Published 11.06.2015
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHICCOMMUNICATION
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Summary:A method for transmitting upper layer application messages into a SCTP packet in which messages are bundled into a packet comprising a SCTP header and a payload. The method comprises receiving messages from an upper layer application; processing messages through a first process stage in which messages may be added to a first buffer for bundling and then to a secondary process stage in which the bundled messages/messages may be further stored in a second buffer until receiver window and congestion window properties are found to be allowable for transmission; transmitting a SCTP packet of bundled messages; receiving an upper layer application message; resolving the time criticality of the message; if high time criticality, transmitting further the message in a payload portion of a SCTP packet to the secondary stage, otherwise processing the message in the first stage so as to potentially bundle the message with other messages.
Bibliography:Application Number: US201314104125