PACKAGED SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING

In one general aspect, a package can include a semiconductor die having a first terminal on a first side of the semiconductor die and a second terminal on a second side of the semiconductor die, a leadframe portion electrically coupled to the second terminal of the semiconductor die, and a molding c...

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Bibliographic Details
Main Authors WU CHUNG-LIN, ASHRAFZADEH AHMAD R, ESTACIO MARIA CRISTINA, MIKOLAJCZAK ADRIAN
Format Patent
LanguageEnglish
Published 11.06.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In one general aspect, a package can include a semiconductor die having a first terminal on a first side of the semiconductor die and a second terminal on a second side of the semiconductor die, a leadframe portion electrically coupled to the second terminal of the semiconductor die, and a molding compound. The first terminal on the first side of the semiconductor die, a first surface of the leadframe portion, and a first surface of the molding compound can define at least a portion of a first surface of the package. A second surface of the molding compound and a second surface of the leadframe portion can define at least a portion of a second surface of the package parallel to the first surface of the package, and the second surface can be on an opposite side of the package from the first surface of the package.
Bibliography:Application Number: US201414560856