WIRING BOARD AND METHOD FOR MOUNTING SEMICONDUCTOR ELEMENT ON WIRING BOARD

A wiring board of the present invention includes an insulating board having a mounting portion on an upper surface to mount a semiconductor element, and semiconductor element connection pads formed on the mounting portion, on which at least three first dummy pads arranged on a center portion of the...

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Bibliographic Details
Main Author NEJIME TAKAYUKI
Format Patent
LanguageEnglish
Published 28.05.2015
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A wiring board of the present invention includes an insulating board having a mounting portion on an upper surface to mount a semiconductor element, and semiconductor element connection pads formed on the mounting portion, on which at least three first dummy pads arranged on a center portion of the mounting portion, and at least three second dummy pads arranged on a peripheral portion of the mounting portion, are formed, and a dummy solder bump is formed on each of the first dummy pad and the second dummy pad.
Bibliography:Application Number: US201414552928