LAYER ARRANGEMENT AND A WAFER LEVEL PACKAGE COMPRISING THE LAYER ARRANGEMENT
The invention relates to a layer arrangement and a wafer level package comprising the layer arrangement, and in particular, the layer arrangement comprises a getter layer and further comprises a sacrificial layer. The wafer level package may be used in microelectromechanical systems (MEMS) packaging...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
14.05.2015
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Subjects | |
Online Access | Get full text |
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Summary: | The invention relates to a layer arrangement and a wafer level package comprising the layer arrangement, and in particular, the layer arrangement comprises a getter layer and further comprises a sacrificial layer. The wafer level package may be used in microelectromechanical systems (MEMS) packaging at a vacuum level of about 10 mTorr or less such as close to 1 mTorr (i.e. MEMS vacuum packaging). |
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Bibliography: | Application Number: US201314372015 |