VERTICALLY INTEGRATED SYSTEMS

Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electric...

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Bibliographic Details
Main Authors IRIARTE SANTIAGO, MURPHY MARK J, CASEY GARY, LYDEN COLIN G, O'DONNELL ALAN J, ENGLISH EOIN EDWARD
Format Patent
LanguageEnglish
Published 07.05.2015
Subjects
ELECTRICITY
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
TESTING
TRANSPORTING
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Summary:Embodiments of the present invention provide an integrated circuit system including a first active layer fabricated on a front side of a semiconductor die and a second pre-fabricated layer on a back side of the semiconductor die and having electrical components embodied therein, wherein the electrical components include at least one discrete passive component. The integrated circuit system also includes at least one electrical path coupling the first active layer and the second pre-fabricated layer.
Bibliography:Application Number: US201514594913