SUBSTRATE PROCESSING APPARATUS AND LIQUID SUPPLY APPARATUS

A substrate processing includes a holding mechanism, a plurality of nozzles, and an adjusting unit. The holding mechanism rotatably holds a substrate. The nozzles are disposed to be arranged in a diametric direction of the substrate held by the holding mechanism and supply a chemical liquid to the s...

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Bibliographic Details
Main Author INOUE SHIGEHISA
Format Patent
LanguageEnglish
Published 30.04.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate processing includes a holding mechanism, a plurality of nozzles, and an adjusting unit. The holding mechanism rotatably holds a substrate. The nozzles are disposed to be arranged in a diametric direction of the substrate held by the holding mechanism and supply a chemical liquid to the substrate. The adjusting unit supplies a chemical liquid of a first temperature and a chemical liquid of a second temperature to each of the plurality of nozzles in a predetermined ratio, in which the second temperature is higher than the first temperature. The adjusting unit supplies the chemical liquid of the second temperature in a higher ratio to a nozzle disposed at an outer circumference side of the substrate than to a nozzle disposed at a center side of the substrate. In addition, the adjusting unit supplies the chemical liquid of the second temperature in a higher ratio to the nozzle disposed at the outer circumference side of the substrate than to the nozzle disposed at the center side of the substrate. Each of the nozzles supplies a chemical liquid in which the supplied chemical liquid of the first temperature and the supplied chemical liquid of the second temperature are mixed with each other.
Bibliography:Application Number: US201414521701