WIRING BOARD, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING WIRING BOARD

• Main Authors: YOKOTA KAORI, ROKUGAWA AKIO, KANEDA WATARU, SHIMIZU NORIYOSHI
• Format: Patent
• Language: English
• Published: 16.04.2015
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

A wiring board includes a first insulating layer containing a thermosetting resin, a first wiring layer stacked on an upper surface of the first insulating layer, a second insulating layer stacked on the upper surface of the first insulating layer, a second wiring layer stacked on an upper surface of the second insulating layer, and a third insulating layer stacked on the upper surface of the second insulating layer. The second and third insulating layers contain a first photosensitive resin. An outer side surface of the second insulating layer is flush with an outer side surface of the first insulating layer. An outer side surface of the third insulating layer is located inside the outer side surface of the second insulating layer in a plan view. The upper surface of the second insulating layer connecting to the outer side surface thereof is exposed from the third insulating layer.