PACKAGE VIAS FOR RADIO FREQUENCY ANTENNA CONNECTIONS

Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection betwe...

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Bibliographic Details
Main Authors GOETZ EDMUND, MOLZER WOLFGANG, MAHNKOPF REINHARD, MEMMLER BERND
Format Patent
LanguageEnglish
Published 26.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
Bibliography:Application Number: US201314037213