SYSTEMS AND METHODS FOR DISSIPATING HEAT IN AN ENCLOSURE

An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more wal...

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Bibliographic Details
Main Authors WHALEN BRYAN PATRICK, GROSS, JR. WILLIAM EARL, MEIER ROBERT PAUL, DE BOCK HENDRIK PIETER JACOBUS
Format Patent
LanguageEnglish
Published 19.03.2015
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
PHYSICS
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Summary:An enclosure is presented. The enclosure includes an outer casing having one or more walls. Further, the enclosure includes a synthetic jet assembly configured to dissipate heat from the one or more walls, where the synthetic jet assembly includes a bracket operatively coupled to the one or more walls of the outer casing and two or more synthetic jets operatively coupled to the bracket, where the two or more synthetic jets are arranged in a multi-dimensional array.
Bibliography:Application Number: US201414547217