SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Provided is a semiconductor flat package with improved mountability. In a semiconductor device, an end surface of a lead, which is exposed from an encapsulation resin, is covered with a plated layer, and a side end surface of the plated layer and a side end surface of the encapsulation resin are flu...

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Bibliographic Details
Main Author YOSHINO TOMOYUKI
Format Patent
LanguageEnglish
Published 19.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Provided is a semiconductor flat package with improved mountability. In a semiconductor device, an end surface of a lead, which is exposed from an encapsulation resin, is covered with a plated layer, and a side end surface of the plated layer and a side end surface of the encapsulation resin are flush with each other. A material with good solder wettability is formed at a lead cut portion of the semiconductor flat package, to thereby improve solder connection strength with a circuit board. A solder fillet is formed from the lead cut portion of the semiconductor package, to thereby enable adaptation of solder automatic visual inspection after mounting.
Bibliography:Application Number: US201414485927