SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

In one embodiment, a semiconductor device includes a lead frame including a chip mounting portion and a lead portion separated from the chip mounting portion and having the same thickness as the chip mounting portion, a level of an upper face of the chip mounting portion being same as a level of an...

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Bibliographic Details
Main Authors KOYAMA SHINICHI, TONEDACHI TATSUO, ARAKI KOJI, OTANI KAZUMI
Format Patent
LanguageEnglish
Published 12.03.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In one embodiment, a semiconductor device includes a lead frame including a chip mounting portion and a lead portion separated from the chip mounting portion and having the same thickness as the chip mounting portion, a level of an upper face of the chip mounting portion being same as a level of an upper face of the lead portion. The device further includes a semiconductor chip mounted on the upper face of the chip mounting portion and electrically connected to the lead portion. The device further includes a molding resin which collectively seals up the lead frame and the semiconductor chip. The device further includes a metal film covering parts of rear faces of the chip mounting portion and the lead portion.
Bibliography:Application Number: US201414202942