CHEMICAL MECHANICAL POLISHING PAD

A chemical mechanical polishing pad is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a specific gravity of greater than 0.6; a Shore D hardness of 60 to 90; an elongation to break o...

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Main Authors HENDRON JEFFREY JAMES, NOWLAND JOHN G, VAN HANEHEM MATTHEW RICHARD, MURNANE JAMES, DEGROOT MARTY W, STRING DARRELL, JENSEN MICHELLE, YEH FENGJI, ISLAM MOHAMMAD T, QIAN BAINIAN
Format Patent
LanguageEnglish
Published 05.03.2015
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:A chemical mechanical polishing pad is provided containing: a polishing layer; a rigid layer; and, a hot melt adhesive bonding the polishing layer to the rigid layer; wherein the polishing layer exhibits a specific gravity of greater than 0.6; a Shore D hardness of 60 to 90; an elongation to break of 100 to 300%; and, a unique combination of an initial hydrolytic stability and a sustained hydrolytic instability.
Bibliography:Application Number: US201314014468