FLUID EJECTION DEVICE

A fluid ejection device is described. In an example, the fluid ejection device includes a substrate having a chamber formed thereon to contain a fluid. A thin-film stack is formed on the substrate having a resistor formed under the chamber. A transistor is formed in the substrate and coupled to the...

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Bibliographic Details
Main Authors GHOZEIL ADAM L, BROWNING ROBERT N K
Format Patent
LanguageEnglish
Published 05.03.2015
Subjects
CORRECTION OF TYPOGRAPHICAL ERRORS
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A fluid ejection device is described. In an example, the fluid ejection device includes a substrate having a chamber formed thereon to contain a fluid. A thin-film stack is formed on the substrate having a resistor formed under the chamber. A transistor is formed in the substrate and coupled to the resistor. A circuit is formed in the substrate coupled to a gate of the transistor to selectively cause the transistor either to supply a firing current to the resistor for ejecting the fluid from the chamber or to dissipate power to warm the device.
Bibliography:Application Number: US201314014979