METHOD FOR PROCESSING A WORKPIECE

A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second...

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Bibliographic Details
Main Authors FRANK MANFRED, KRENZER MICHAEL, KUNSTMANN THOMAS, HESS EVA-MARIA
Format Patent
LanguageEnglish
Published 29.01.2015
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for processing a workpiece may include: providing a workpiece including a first region and a second region; forming a porous metal layer over the first region and the second region; wherein the first region and the second region are configured such that an adhesive force between the second region and the porous metal layer is lower than an adhesive force between the first region and the porous metal layer.
Bibliography:Application Number: US201313948208