SYSTEM AND METHOD FOR LEAD FRAME PACKAGE DEGATING
A method of forming an electronic component includes masking a lead frame to form a mask defining an exposed area, oxidizing the exposed area of the lead frame, wherein the mask inhibits oxidation of an unexposed area, and removing the mask from the lead frame following oxidizing. A lead frame can i...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
29.01.2015
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Subjects | |
Online Access | Get full text |
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Summary: | A method of forming an electronic component includes masking a lead frame to form a mask defining an exposed area, oxidizing the exposed area of the lead frame, wherein the mask inhibits oxidation of an unexposed area, and removing the mask from the lead frame following oxidizing. A lead frame can include a metal sheet patterned to define a pad region and leads. The metal sheet includes metal oxide in a select area. The pad region is substantially free of metal oxide. |
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Bibliography: | Application Number: US201313950618 |