EMANATION SYSTEM AND METHOD FOR USE

An emanation system is disclosed that include a substrate, a secondary substrate, and an air treatment material. The secondary substrate is adapted to be wetted with runoff from the air treatment material applied to the substrate. When applied, the air treatment material emanates from the substrate...

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Bibliographic Details
Main Authors MEIER MAUDE CHRISTIAN, GAO FEI, YUHAS RANDY C
Format Patent
LanguageEnglish
Published 01.01.2015
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Summary:An emanation system is disclosed that include a substrate, a secondary substrate, and an air treatment material. The secondary substrate is adapted to be wetted with runoff from the air treatment material applied to the substrate. When applied, the air treatment material emanates from the substrate at a first release rate and from the secondary substrate at a second release rate.
Bibliography:Application Number: US201414309549