CAMERA MODULE

A camera module includes an image sensor IC, a resin multilayer board including thermoplastic resin layers stacked in a direction perpendicular or substantially perpendicular to a light receiving surface of the image sensor IC, a mounting electrode which is stacked on the thermoplastic resin layer a...

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Bibliographic Details
Main Authors IKEMOTO NOBUO, HSIEH JERRY, KUMANO ATSUSHI, SASAKI JUN
Format Patent
LanguageEnglish
Published 25.12.2014
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
PICTORIAL COMMUNICATION, e.g. TELEVISION
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Summary:A camera module includes an image sensor IC, a resin multilayer board including thermoplastic resin layers stacked in a direction perpendicular or substantially perpendicular to a light receiving surface of the image sensor IC, a mounting electrode which is stacked on the thermoplastic resin layer and on which the image sensor IC is mounted, and a via-hole conductor electrically connected to the mounting electrode. The resin multilayer board includes a flat plate portion including a surface on which the mounting electrode is mounted, and a rigid portion including a greater number of thermoplastic resin layers than that of the flat plate portion, and the via-hole conductor is arranged in the flat plate portion so as to avoid the thermoplastic resin layer on which the mounting electrode is stacked.
Bibliography:Application Number: US201414483190