PRESSURE SENSOR AND METHOD OF PACKAGING SAME

A method of packaging a pressure sensor die begins with patterning and etching a metal strip and forming metal traces on the strip. Further build-up is performed to transform the metal strip into a layered substrate. Cavity walls are formed on one side of the strip with a molding process and then th...

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Bibliographic Details
Main Author LO WAI YEW
Format Patent
LanguageEnglish
Published 25.12.2014
Subjects
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Summary:A method of packaging a pressure sensor die begins with patterning and etching a metal strip and forming metal traces on the strip. Further build-up is performed to transform the metal strip into a layered substrate. Cavity walls are formed on one side of the strip with a molding process and then the metal on the back side of the strip is removed. Next semiconductor dies are attached to the strip within the cavities and electrically connected to pads formed on the surface of the strip and/or to pads on other ones of the dies. A gel coating is deposited over the dies and then a metal lid is secured over the cavity. The strip is then singulated along ones of the cavity walls to form multiple sensor devices.
Bibliography:Application Number: US201313924633