Fe-Pt-Ag-C-Based Sputtering Target Having C Grains Dispersed Therein, and Method for Producing Same

An Fe-Pt-Ag-C-based sintered compact sputtering target having a composition represented by a formula (Fe100-X-PtX)100-Y-Z-AgY-CZ (wherein X represents a numerical value satisfying a formula 35 X 55; Y represents a numerical value satisfying a formula 0.5 Y 15; and Z represents a numerical value sati...

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Bibliographic Details
Main Authors TAKAMI HIDEO, SATO ATSUSHI
Format Patent
LanguageEnglish
Published 11.12.2014
Subjects
BASIC ELECTRIC ELEMENTS
CASTING
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
PERFORMING OPERATIONS
POWDER METALLURGY
TRANSPORTING
WORKING METALLIC POWDER
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Summary:An Fe-Pt-Ag-C-based sintered compact sputtering target having a composition represented by a formula (Fe100-X-PtX)100-Y-Z-AgY-CZ (wherein X represents a numerical value satisfying a formula 35 X 55; Y represents a numerical value satisfying a formula 0.5 Y 15; and Z represents a numerical value satisfying a formula 15 Z 55) when expressed in an atomic ratio, and having a relative density of 93% or more. A method for producing an Fe-Pt-Ag-C-based sintered compact sputtering target, characterized in that an Fe-Pt-C sintered compact is produced in advance, the sintered compact is pulverized to produce a pulverized powder, the pulverized powder is mixed with a Ag powder, and the resultant mixed powder is subject to sintering at a temperature lower than a melting point of Ag. An object of this invention is to provide a high-density sputtering target which enables the production of a magnetic thin film having a granular structure without the use of expensive co-sputtering equipment and which enables the reduction in the amount of particles generated during sputtering.
Bibliography:Application Number: US201314372849