LAMINATE PERIPHERAL CLAMPING TO CONTROL MICROELECTRONIC MODULE BSM WARPAGE

• Main Authors: OSTRANDER STEVEN P, BEAUMIER MARTIN, DRAPEAU JEAN-FRANCOIS, ALLARD STEPHANIE, LABONTE JEAN, OUIMET SYLVAIN
• Format: Patent
• Language: English
• Published: 11.12.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A clamping apparatus and method for applying a force to a workpiece during processing includes a base defining a work area. The work area is configured to receive a joined structure including a substrate and a die. A component is positionable in the work area and over the joined structure. An adjustable releasable structure is positionable over the component and the joined structure and includes a resilient mechanism having an inner member for contacting the component to apply an inner downward force to the component. The resilient mechanism also includes outer members for applying an outer downward force to opposing distal edge areas of the substrate. An external downward force is applied to the adjustable releasable structure, such that the inner and outer members apply the inner and outer downward forces to the component and the opposing distal edge areas of the substrate, respectively, during processing of the joined structure.