HEAT DISSIPATION DEVICE EMBEDDED WITHIN A MICROELECTRONIC DIE

The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least one trench extending into the microelectronic die from a microelectronic die back surface, which opposes...

Full description

Saved in:
Bibliographic Details
Main Authors ROY MIHIR K, KONCHADY MANOHAR S
Format Patent
LanguageEnglish
Published 04.12.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least one trench extending into the microelectronic die from a microelectronic die back surface, which opposes an active surface thereof, and filling the trenches with at least one layer of thermally conductive material. In one embodiment, the heat dissipation device may be a thermoelectric cooling device.
Bibliography:Application Number: US201313904169