CURABLE COMPOSITION
Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ab...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
27.11.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability and workability, no whitening and surface stickiness, and an excellent adhesive property. Since the curable composition has excellent thermal resistance, gas barrier-ability, and crack resistance, even when a semiconductor device to which the composition is applied is used at a high temperature for a long time, performance of the device may be stably maintained. |
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Bibliography: | Application Number: US201414459184 |