HIGH POWER DIELECTRIC CARRIER WITH ACCURATE DIE ATTACH LAYER

• Main Authors: GAO ZIYANG, REN YUXING
• Format: Patent
• Language: English
• Published: 20.11.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the firs...