HIGH POWER DIELECTRIC CARRIER WITH ACCURATE DIE ATTACH LAYER

A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the firs...

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Bibliographic Details
Main Authors GAO ZIYANG, REN YUXING
Format Patent
LanguageEnglish
Published 20.11.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A system for bonding a die to a high power dielectric carrier such as a ceramic dielectric core with double-sided conductive layers is described. In the system, the upper conductive layer has a first area whose surface has a first wettability. A second area that at least partially surrounds the first area has a surface with a second wettability that is greater than the first wettability. During bonding, an adhesive material bonding a chip to the substrate spreads among the first area by a downward force placed on the chip. Due to the difference in wettability, the adhesive material then spreads among the second area by a wetting force generated by the greater second wettability of the second area surface causing the chip to be drawn down until reaching a predetermined position. The predetermined position can be determined by substrate protrusions or substrate cavities.
Bibliography:Application Number: US201313896356