LAND GRID ARRAY INTERCONNECT FORMED WITH DISCRETE PADS
A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete met...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
06.11.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A land grid array (LGA) includes a grid array of metal pads plated directly onto a printed circuit board, and a discrete metal pad soldered to each of the plated metal pads in the grid array. Each discrete metal pad has an exposed contact surface after soldering, and a thickness of each discrete metal pad is selected as a function of location in the grid array so that the discrete pads provide a locus of exposed surfaces having greater flatness than the printed circuit board. |
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Bibliography: | Application Number: US201414323048 |