BARRIER LAYER ON BUMP AND NON-WETTABLE COATING ON TRACE
Some implementations provide a semiconductor device that includes a die, an under bump metallization (UBM) structure coupled to the die, and a barrier layer. The UBM structure has a first oxide property. The barrier layer has a second oxide property that is more resistant to oxide removal from a flu...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
30.10.2014
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Subjects | |
Online Access | Get full text |
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Summary: | Some implementations provide a semiconductor device that includes a die, an under bump metallization (UBM) structure coupled to the die, and a barrier layer. The UBM structure has a first oxide property. The barrier layer has a second oxide property that is more resistant to oxide removal from a flux material than the first oxide property of the UBM structure. The barrier layer includes a top portion, a bottom portion and a side portion. The top portion is coupled to the UBM structure, and the side portion is substantially oxidized. |
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Bibliography: | Application Number: US201414328618 |