METHOD OF FORMING FILM

A method of forming a film including forming a film on a substrate by coating a composition for forming a film containing a solvent and a resin by a spin coating method, in which a maximum radius among the radii from the center to the outer periphery of the substrate is 150 mm or more and a thicknes...

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Bibliographic Details
Main Authors TACHI TOSHIAKI, KUMADA SHINJI, KATAYAMA SHOTA, IRIE MAKIKO
Format Patent
LanguageEnglish
Published 23.10.2014
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Summary:A method of forming a film including forming a film on a substrate by coating a composition for forming a film containing a solvent and a resin by a spin coating method, in which a maximum radius among the radii from the center to the outer periphery of the substrate is 150 mm or more and a thickness of the film is 50 μm or more, a vapor pressure of the solvent at 25° C. is 0.4 kPa or less, and a viscosity of the solvent measured by a Cannon-Fenske viscometer at 25° C. is 1.5 mPa·s or less.
Bibliography:Application Number: US201414255273