PHOTOSENSITIVE NEGATIVE RESIN COMPOSITION

A photosensitive negative resin composition including (a) an epoxy-group-containing compound, (b) a first onium salt including a cation moiety structure represented by formula (b1) and an anion moiety structure represented by formula (b2), and (c) a second onium salt including a cation moiety struct...

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Bibliographic Details
Main Author TAKAHASHI HYOU
Format Patent
LanguageEnglish
Published 16.10.2014
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
CORRECTION OF TYPOGRAPHICAL ERRORS
ELECTROGRAPHY
HOLOGRAPHY
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
MATERIALS THEREFOR
ORIGINALS THEREFOR
PERFORMING OPERATIONS
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A photosensitive negative resin composition including (a) an epoxy-group-containing compound, (b) a first onium salt including a cation moiety structure represented by formula (b1) and an anion moiety structure represented by formula (b2), and (c) a second onium salt including a cation moiety structure represented by formula (c1) and an anion moiety structure represented by formula (c2).
Bibliography:Application Number: US201414225662