CASE, METHOD OF MANUFACTURING CASE, AND ELECTRONIC DEVICE
A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface of the...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
18.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | A case for an electronic device includes an injection preform having a recess on at least one portion of a surface thereof, a deposition layer deposited on a surface of the injection preform, and a paint layer formed on the deposition layer. The deposition layer may directly contact a surface of the injection preform. A method of manufacturing a case includes injection-molding an injection preform having a recess on a surface thereof, forming a deposition layer directly contacting a surface of the injection preform, and forming a paint layer on the deposition layer. |
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Bibliography: | Application Number: US201414210191 |