HEAT SLUG HAVING THERMOELECTRIC ELEMENTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
In a heat slug and a semiconductor package including the same, the heat slug includes a thermal conductive body having an active face and a dissipating face opposite to the active face, a dielectric layer covering the active face of the body, at least one thermoelectric element arranged on the diele...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
18.09.2014
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Subjects | |
Online Access | Get full text |
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Summary: | In a heat slug and a semiconductor package including the same, the heat slug includes a thermal conductive body having an active face and a dissipating face opposite to the active face, a dielectric layer covering the active face of the body, at least one thermoelectric element arranged on the dielectric layer and a conductive pattern arranged on the dielectric layer and electrically connected to the thermoelectric element. The electrical characteristics of the thermoelectric element are interacted with heat generated from a heat source. |
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Bibliography: | Application Number: US201314132790 |