HEAT SLUG HAVING THERMOELECTRIC ELEMENTS AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

In a heat slug and a semiconductor package including the same, the heat slug includes a thermal conductive body having an active face and a dissipating face opposite to the active face, a dielectric layer covering the active face of the body, at least one thermoelectric element arranged on the diele...

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Bibliographic Details
Main Authors KIM JIUL, HWANG HEE-JUNG, SHIN SEONG-HO
Format Patent
LanguageEnglish
Published 18.09.2014
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
COMBINED HEATING AND REFRIGERATION SYSTEMS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT PUMP SYSTEMS
HEATING
LIGHTING
LIQUEFACTION SOLIDIFICATION OF GASES
MANUFACTURE OR STORAGE OF ICE
MECHANICAL ENGINEERING
REFRIGERATION MACHINES, PLANTS OR SYSTEMS
REFRIGERATION OR COOLING
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:In a heat slug and a semiconductor package including the same, the heat slug includes a thermal conductive body having an active face and a dissipating face opposite to the active face, a dielectric layer covering the active face of the body, at least one thermoelectric element arranged on the dielectric layer and a conductive pattern arranged on the dielectric layer and electrically connected to the thermoelectric element. The electrical characteristics of the thermoelectric element are interacted with heat generated from a heat source.
Bibliography:Application Number: US201314132790