Backside CMOS Compatible BioFET with No Plasma Induced Damage

The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioF...

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Bibliographic Details
Main Authors LIU YI-SHAO, CHENG CHUN-REN, CHANG YI-HSIEN, CHENG CHUN-WEN, CHEN CHING-RAY, LAI FEI-LUNG
Format Patent
LanguageEnglish
Published 11.09.2014
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Summary:The present disclosure provides a bio-field effect transistor (BioFET) device and methods of fabricating a BioFET and a BioFET device. The method includes forming a BioFET using one or more process steps compatible with or typical to a complementary metal-oxide-semiconductor (CMOS) process. The BioFET device includes a gate structure disposed on a first surface of a substrate and an interface layer formed on a second surface of the substrate. The substrate is thinned from the second surface to expose a channel region before forming the interface layer.
Bibliography:Application Number: US201414281100