METHODS FOR ELECTROCHEMICAL DEPOSITION OF MULTI-COMPONENT SOLDER USING CATION PERMEABLE BARRIER

Processes and systems for electrochemical deposition of a multi-component solder by processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid...

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Bibliographic Details
Main Authors BATZ, JR. ROBERT W, KIM BIOH, KULZER ROSS, RITZDORF THOMAS L, BERNT MARVIN L, BASKARAN RAJESH, HANSON KYLE M, KLOCKE JOHN L
Format Patent
LanguageEnglish
Published 04.09.2014
Subjects
APPARATUS THEREFOR
CHEMISTRY
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Summary:Processes and systems for electrochemical deposition of a multi-component solder by processing a microfeature workpiece with a first processing fluid and an anode are described. Microfeature workpieces are electrolytically processed using a first processing fluid, an anode, a second processing fluid, and a cation permeable barrier layer. The cation permeable barrier layer separates the first processing fluid from the second processing fluid while allowing certain cationic species to transfer between the two fluids.
Bibliography:Application Number: US201414194610