In-situ Compressed Specimen for Evaluating Mechanical Property of Copper Interconnection Micro Column and Preparation Method thereof

• Main Authors: GU TING, WANG ZHAOYU, CHENG PING, DING GUIFU, ZHANG CONGCHUN, WANG HONG, WANG HUIYING
• Format: Patent
• Language: English
• Published: 28.08.2014
• Subjects: GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; MEASURING; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; PHYSICS; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS; TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION; TECHNICAL SUBJECTS COVERED BY FORMER USPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS; TESTING; TRANSPORTING

An in-situ compressed specimen of copper interconnection micro column, which is a circular metal column formed in a PDMS hole, includes: a specimen part and a fixed end part for fixing the specimen; wherein the fixed end part is a circular or square plate structure, the specimen part is an upper part of the fixed end part; a main body of the present invention is of micron order, a forced direction of the specimen is consistent with a growth direction of the metal column. A method of electroplating copper column by adopting PDMS as template substrate is applied to overcome a problem that TSV is corrosive to the copper column during a silicon etching process so as to affect a mechanical property accuracy test, the method is advanced in shortening test process period, achieving good reproducibility and high yield.