SEMICONDUCTOR CHIP PACKAGE STRUCTURE

• Main Authors: CHEN LONGI, LIU CHIAO, WANG CHIH-JUI
• Format: Patent
• Language: English
• Published: 21.08.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed...