SEMICONDUCTOR CHIP PACKAGE STRUCTURE

A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed...

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Bibliographic Details
Main Authors CHEN LONGI, LIU CHIAO, WANG CHIH-JUI
Format Patent
LanguageEnglish
Published 21.08.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method for fixing a semiconductor chip on a circuit board is provided, which includes following steps. The circuit board is provided, which sequentially includes a substrate having a chip connecting portion, at least one metal wire and an insulating layer. An organic insulating material is formed on the insulating layer of the outside edge of the chip connecting portion. An anisotropic conductive film (ACF) is then formed to cover the chip connecting portion and a portion of the organic insulating material Finally, a semiconductor chip is hot-pressed on the ACF. The organic insulating material formed on the insulating layer is used to prevent the metal wires beneath the insulating layer from occurring of corrosion. A semiconductor chip package structure is also provided.
Bibliography:Application Number: US201414259166