SEMICONDUCTOR DEVICE INCLUDING COOLER

A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor ele...

Full description

Saved in:
Bibliographic Details
Main Authors NORITAKE CHIKAGE, KANEKO TAKAHISA, MAMITSU KUNIAKI, NISHIHATA MASAYOSHI, ITOH TOSHIKI, NOMURA EIJI, TONOMOTO MASAYA, WADO HIROYUKI
Format Patent
LanguageEnglish
Published 24.07.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.
Bibliography:Application Number: US201414220277