PIPING JOINT AND SEMICONDUCTOR MANUFACTURING APPARATUS
The piping joint according to the present embodiment includes a joint part that joins a plurality of pipes for transporting a medium to one another. At least one conductive line is provided between the pipes so as to extend over cross-sections of the pipes. A ground part grounds the conductive line....
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
24.07.2014
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Subjects | |
Online Access | Get full text |
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Summary: | The piping joint according to the present embodiment includes a joint part that joins a plurality of pipes for transporting a medium to one another. At least one conductive line is provided between the pipes so as to extend over cross-sections of the pipes. A ground part grounds the conductive line. The conductive line removes electric charges from the medium via the ground part. |
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Bibliography: | Application Number: US201313898747 |