PIPING JOINT AND SEMICONDUCTOR MANUFACTURING APPARATUS

The piping joint according to the present embodiment includes a joint part that joins a plurality of pipes for transporting a medium to one another. At least one conductive line is provided between the pipes so as to extend over cross-sections of the pipes. A ground part grounds the conductive line....

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Bibliographic Details
Main Authors KUGIMIYA KENZO, ASAMI NORIYUKI, KITAMURA KOUDAI, TACHIBANA KATSUHIKO, YAMADA NOBUHIDE
Format Patent
LanguageEnglish
Published 24.07.2014
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ENGINEERING ELEMENTS AND UNITS
GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS
HEATING
JOINTS OR FITTINGS FOR PIPES
LIGHTING
MEANS FOR THERMAL INSULATION IN GENERAL
MECHANICAL ENGINEERING
PERFORMING OPERATIONS
PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
PIPES
SEMICONDUCTOR DEVICES
SEPARATION
SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING
THERMAL INSULATION IN GENERAL
TRANSPORTING
WEAPONS
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Summary:The piping joint according to the present embodiment includes a joint part that joins a plurality of pipes for transporting a medium to one another. At least one conductive line is provided between the pipes so as to extend over cross-sections of the pipes. A ground part grounds the conductive line. The conductive line removes electric charges from the medium via the ground part.
Bibliography:Application Number: US201313898747