Method for Bonding Substrates

• Main Authors: SCHAEVITZ SAMUEL B, BYARS ZACHARY, AKHTAR MOHAMMAD MASYOOD
• Format: Patent
• Language: English
• Published: 10.07.2014
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; BLASTING; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS; CHEMISTRY; DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING; DYES; ELECTRICITY; ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS; GLASS; HEATING; JOINING GLASS TO GLASS OR OTHER MATERIALS; LIGHTING; MECHANICAL ENGINEERING; METALLURGY; MINERAL OR SLAG WOOL; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS; SURFACE TREATMENT OF GLASS; THERMAL INSULATION IN GENERAL; USE OF MATERIALS AS ADHESIVES; WEAPONS

The method for bonding a first substrate to a second substrate includes dispensing a paste directly onto a first substrate, the paste including a glass powder, a thermoplastic, and a first solvent, evaporating the first solvent to form a thickened paste, placing a second substrate on the thickened paste to form a stack, applying to the stack a force sufficient to cause deformation of the thickened paste, and heating the stack to a bonding temperature above a glass transition temperature of the glass powder so as to cause removal of the thermoplastic from the thickened paste and to form a glass joint between the first and second substrates.