MODIFIED VIA BOTTOM FOR BEOL VIA EFUSE

An electronic fuse structure including an Mx level including a first Mx metal, a second Mx metal, and an Mx cap dielectric above of the first and second Mx metal, an Mx+1 level above the Mx level, the Mx+1 level including an Mx+1 metal and a via electrically connecting the Mx metal to the Mx+1 metal...

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Bibliographic Details
Main Authors FILIPPI RONALD G, SIMON ANDREW H, CHOI SAMUEL S, BAO JUNJING, LUSTIG NAFTALI E, BONILLA GRISELDA
Format Patent
LanguageEnglish
Published 03.07.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic fuse structure including an Mx level including a first Mx metal, a second Mx metal, and an Mx cap dielectric above of the first and second Mx metal, an Mx+1 level above the Mx level, the Mx+1 level including an Mx+1 metal and a via electrically connecting the Mx metal to the Mx+1 metal in a vertical orientation, and a nano-pillar located within the via and above the second Mx metal.
Bibliography:Application Number: US201313732466