INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE

An integrated circuit package has a leadframe having an open space extending therethrough. An integrated circuit device is attached to a portion of the upper surface of the leadframe. A shunt is located within the open space such that it is not in contact with any portion of the leadframe.

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Bibliographic Details
Main Authors UDOMPANYAVIT UBOL A, ABBOTT DONALD C, PARKS BRIAN E
Format Patent
LanguageEnglish
Published 26.06.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit package has a leadframe having an open space extending therethrough. An integrated circuit device is attached to a portion of the upper surface of the leadframe. A shunt is located within the open space such that it is not in contact with any portion of the leadframe.
Bibliography:Application Number: US201414189874