Positive Photosensitive Resin Composition

Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, whe...

Full description

Saved in:
Bibliographic Details
Main Authors KIM SANG-SOO, LEE JONG-HWA, LEE JIN-YOUNG, CHEON HWAN-SUNG, KIM DAE-YUN, YOON EUN-KYUNG, HWANG EUN-HA, KWON JI-YUN, KIM SANG-KYEON, HONG CHUNG-BEOM, LEE JUN-HO, KIM SANG-KYUN, CHO HYUN-YONG
Format Patent
LanguageEnglish
Published 19.06.2014
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:Disclosed is a positive photosensitive resin composition that includes (A) an alkali soluble resin selected from a polybenzoxazole precursor, a polyimide precursor, and a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) an organic dye and (E) a solvent, wherein the organic dye (D) includes at least one red dye having an absorption wavelength of 590 to 700 nm, at least one yellow dye having an absorption wavelength of 550 to 590 nm, and at least one blue dye having an absorption wavelength of 450 to 500 nm.
Bibliography:Application Number: US201214236971