SEMICONDUCTOR PACKAGE SIGNAL ROUTING USING CONDUCTIVE VIAS

• Main Author: YAP WENG FOONG
• Format: Patent
• Language: English
• Published: 19.06.2014
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A mechanism is provided by which signal travel distance within and between semiconductor device packages is reduced and substrate size and complexity can be reduced. This capacity is provided by virtue of a conductive via that intersects a wire bond molded within a package substrate. The via provides a direct electrical connection between an external signal transmitter or receiver and the points connected by the wire bond, and thereby avoiding the need for the signal to transit built up interconnects in the semiconductor device package. Conductive vias can provide connectivity through or to a package substrate, and can be through vias or blind vias. The conductive via is formed by either mechanical or laser drilling, and is filled using standard fill techniques, and is therefore readily incorporated into a package production flow.