METHODS AND SYSTEMS FOR TEMPERATURE REGULATION DEVICES

A heat exchanger for coupling to a device is described. The heat exchanger includes an inner layer configured for placement against at least one surface of the device, an outer layer opposite the inner layer, a fluid chamber defined between the outer layer and the inner layer, an inlet for directing...

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Bibliographic Details
Main Authors CHERUKUPALLI NAGENDRA SRINIVAS, PRAKASH MARATH, KOPPIKAR SANDEEP RAMMOHAN
Format Patent
LanguageEnglish
Published 19.06.2014
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A heat exchanger for coupling to a device is described. The heat exchanger includes an inner layer configured for placement against at least one surface of the device, an outer layer opposite the inner layer, a fluid chamber defined between the outer layer and the inner layer, an inlet for directing a thermal transfer fluid into the fluid chamber, an outlet for receiving the thermal transfer fluid from the fluid chamber, and at least one filler within the fluid chamber. The filler is coupled to the outer layer and the inner layer and configured to control a flow of the thermal transfer fluid between the inlet and the outlet.
Bibliography:Application Number: US201314106437